ISMP 2020 is the 19th International Symposium on Microelectronics and Packaging. ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry. This year, the conference is held to provide a bigger chance to exchange ideas and experiences from November 11 to 13, 2020 at Busan, Korea.
As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.
We look forward to seeing you in Busan at the ISMP 2020.

Title The 19th International Symposium on Microelectronics and Packaging
Date November 11(Wed.)-13(Fri.), 2020
Venue Busan, Korea
Host Korea Microelectronics and Package Society
Program Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation, Banquet and Social Program
Website www.ismp2020.org
Offcial Language English
Key Dates
Abstract submission July 15, 2020
Acceptance notification August 31, 2020
Pre-registration October 30, 2020
Manuscript submission December 31, 2020
Secretariat KMEPS(Korea Microelectronics and Packaging Society)
4F, 74, Dongjak-daero, Seocho-gu, Seoul, 06676, Korea
Tel.: +82-2-538-0962
E-mail : kmeps@ismp2020.org