It is our pleasure to announce that the 19th International Symposium on Microelectronics and Packaging (ISMP 2020) will be held at Busan, Korea, on November 11-13, 2020. This international conference is organized by KMEPS (the Korean Microelectronics and Packaging Society), and will address comprehensive coverage of recent advances in electronic packaging process and materials. This conference will be proceed with oral and poster presentations on the latest electronic packaging technologies for three days. This will provide an excellent opportunity for researchers and engineers of academic institutes and industries to discuss recent advances and new technology directions. We cordially invite you to submit abstracts for the conference, and look forward to welcoming you in Korea.
| Prof. Joungho Kim Terahertz Interconnection and Package Lab. Korea Advanced Institute of Science and Technology (KAIST), Korea “Title: TBD” |
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| Prof. KOYANAGI Mitsumasa Brain Science Center Tohoku University, Japan “Title: TBD” |
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| Dr. Jin Young Khim, VP VP of Corporate R&D Amkor Technology Inc., Korea “Title: TBD” |
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ISMP 2020 will include all fundamental and applied sciences and technologies related to the fields of electronic materials, devices, and packaging. Topics may include from, but are not limited to the following areas:
- Advanced Packaging Technologies
- Electronic Materials for Interconnects and Packaging
- Emerging Process for Interconnects and Packaging
- PCB, Solder, and Assembly Process
- Power Electronic Packaging
- Sensors, LED, and Emerging Packaging Technology
- Wearable and Printed Electronics
- MEMS/NEMS Packaging and Applications
- Reliability of Electronic Devices and Systems
- Design Tools and Modeling
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: ISMP2020 conference canceled due to COVID-19 pandemic
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2020-05-07 |
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ISMP 2020 Website Open!
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2020-03-12 |
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